Digital Image Correlation

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What is Digital Image Correlation (DIC)?

Digital image correlation (DIC) is a non-contact measuring technique based on Digital Image Processing. DIC is capable of mapping 3D coordinates and evaluating displacement and strain maps on the surface of measured samples. DIC uses a stochastic pattern and/or point markers to track the surface of the materials with subpixel accuracy.

This technique can be used for a wide range of applications in materials research and component testing to analyze the static and dynamic behaviors of specimens. The full field strain map generated by the DIC algorithm is commonly use to replace strain gauges and other traditional sensors for simulation (FEA) validation.


ARAMIS is a non-contact turn-key measuring system based on Digital Image Correlation. It is used across industries for full-field and point-based analyses of test objects of just a few millimeters up to very large structural components. ARAMIS is material and scale independent. If the component can be seen, it can be measured!

The ARAMIS technology can performs high-precision measurements with a 3D resolution in the sub-micrometer range, regardless of the specimen’s geometry and temperature, reducing the need for time-consuming and expensive preparation. ARAMIS is commonly used to replace strain gauges, extensometers, laser scanning vibrometers, accelerometers, and other mechanical sensors. It can measure dynamically and accurately:

  • 3D coordinates
  • 3D displacements, velocities, accelerations
  • Surface strain
  • Evaluations of 6 degrees of freedom (6DoF)

The ARAMIS Professional platform is developed by our partner, GOM. With over 20 years of experience, 60+ sites and a team of more than 1,000 metrology specialist worldwide, GOM guarantees professional advice as well as local support and service. With more than 14,000 system installed worldwide with Trilion and GOM's network combined, our technologies improve product quality and accelerate product development every day.

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