3D Motion & Deformation Sensor
ARAMIS is a non-contact and material-independent measuring system based on digital image correlation. It offers a stable solution for full-field and point-based analyses of test objects of just a few millimeters up to structural components of several meters in size.
The system performs high-precision measurements with a 3D measurement resolution in the sub-micrometer range, regardless of the specimen’s geometry and temperature. There is no need for a time-consuming and expensive preparation. For statically or dynamically loaded specimens and components, ARAMIS provides accurate:
- 3D coordinates
- 3D displacements, velocities, accelerations
- Surface strain
- Evaluations of 6 degrees of freedom (6DoF)
The ARAMIS measuring data is used to determine material properties. These material properties are typically used as parameters for numerical simulations and contribute to improving the results of finite element simulations.
Properties are for example:
- Young’s modulus
- R-value and n-value during tensile tests
- Forming limit curve during Nakajima tests
Synchronized Image Acquisition
ARAMIS Professional supports the direct acquisition of images with all ARAMIS sensors and the synchronized acquisition of analog data with the GOM Testing Controller. It controls the triggering of the sensors as well as the light management and enables the integration in existing testing environments.
Parametric Software Concept
With GOM’s parametric concept, each individual element retains its creation path within the software structure. All actions and evaluation steps are fully traceable and interlinked. Individual elements can be modified and adjusted at any time, and a one-button solution updates all dependent elements automatically after changes have been made.
The timeline is an integrated element in the graphical user interface and supports the management of measurement projects. Functionalities for the definition of areas of interest are implemented as stage ranges and help the user to navigate through the measuring data and to focus the evaluation and the reporting on important time periods of the measurement project.
Digital Image Correlation
Digital image correlation (DIC) is an optical non-contact method to measure 3D coordinates for the evaluation of 3D surfaces, 3D motion and deformation. Stochastic patterns and/or point markers are utilized to describe discrete image areas, which can be determined with subpixel accuracy by analyzing the image information. With this principle, point-wise and full-field measuring results are created and used for a wide range of applications in materials research and component testing to determine the static and dynamic behavior of specimens, such as displacements and strain. Thus, DIC enables an analytical investigation of the complex behavior of any test object.
3D Motion & Deformation Analysis
For the analysis of 3D motion and deformation, GOM Correlate uses a component concept, in which user-defined groups of points are consolidated and tracked over a certain time. This time-based component evaluation results in 3D coordinates in all evaluated images, which are used for the accurate computation of 3D displacements. Component groups are additionally used for the compensation of rigid body motions by analysing and subtracting the displacements in between these groups. Moreover, knowing the exact 3D displacement of a component allows the evaluation of 6 degrees of freedom in terms of translation and rotation in 3D space.
Most results, such as displacements and strain, are calculated using pre-defined inspection principles throughout the standard evaluation workflow. For specific evaluations, GOM Correlate provides an interface that allows the implementation of user-defined mathematics and formulas and enables the automatic computation of the corresponding results.
Image mapping acts as an intuitive user interface that supports the user in all work steps for the project definition, the analysis of results and the reporting. All necessary user interactions are directly performed on the measurement images and results are instantly displayed, such as vector fields and full-field displacement and strain.
- Application Note: Multiple sensor measurements