Thank you for your interest in Industry 4.0 Formability Webinar! If you couldn’t attend the IoT Experience for Manufacturers virtual event where the webinar took place, we have you covered.
Knowing the properties of incoming material is crucial when working through the various phase of tool and die development. Here’s an IoT technology, optical forming analysis (OFA), developed to replace the conventional circle grid analysis (CGA), which allows operators to analyze full-field formability of a sheet metal panel. Metal formers can use the data to track die-station health during production.
1. Digital Image Correlation (DIC) for Material Properties
2. Optical Forming Analysis (OFA) Patterning
3. Optical Forming Analysis (OFA) Measurement
4. Digital Image Correlation (DIC) for Press Deflection
If you have any questions, please send them our way.