Date: Wednesday, April 28, 2021 Time: 2:00 PM (Eastern Time)
High temperature is a critical concern for most testing in the automotive, aerospace, and energy industries. Thermal expansion is ever-present and a challenge: Which strains are due to the mechanical load and which apparent strains occur simply because of temperature change. Moreover, these effects are strongly coupled because a significant part of the stress energy used for the deformation is converted to heat, raising the material’s temperature, which in turn affects the material and the deformation that is taking place.
Digital Image Correlation (DIC) optical strain is the most efficient optical non-contact measurement method to measure strains. This presentation demonstrates the use of Telops, high-speed infrared camera, and the Trilion, ARAMIS Thermography for the true measurement of thermal and mechanical strains. The ARAMIS Thermography tool combines the power of DIC with the utility of infrared cameras. The results shown in this presentation will illustrate the uses of a full turn-key thermography and deformation testing solutions for material analysis with applications from the testing of engines to microelectronics.