ARAMIS Digital Image Correlation System
The ARAMIS digital image correlation system is an advanced 3D measurement tool for better understanding material and component behavior.
ARAMIS is a non-contact and material independent measuring system providing high resolution images, and highly accurate information about a component’s 3D shape, as well as strain and deformation response for a test article subject to a load or force.
The Digital Image Correlation system is an optical replacement for strain gauges, extensometers, accelerometers, LVDTS, laser trackers, laser scanners, scanning laser vibrometers, and other deformation tools.
An operator could expect all of these capabilities in one complete package.
This advanced Digital Image Correlation system documents, calculates, and analyzes the deformation in 3 dimensions and easily integrates into existing processes and testing environments. ARAMIS produces experimental results that directly compare with finite element analysis.
- For more information on the Digital Image Correlation system, go here.
- To understand when the Digital Image Correlation system is the right tool, go here.
- To learn more about High Speed Digital Image Correlation, go here.
- To contact an Applications Engineer go here.
Features and Benefits
- Digitally replaces analog instrumentation including strain gauges, extensometers, LVDT’s accelerometers, surface profilometers.
- ARAMIS Digital Image Correlation system is a non-contact method of measurement; strain can be measured for materials in circumstances where extensometers may slip on the specimen during testing, may be cumbersome to use, or in cases where strain gauges cannot be applied.
- Digital Image Correlation systems measure the complex 3D shape and shape change over time (deformation). Rather than the single point output of a strain gauge, the ARAMIS system provides a full-field 3D strain distribution.
- A unique understanding of materials response can be obtained from visualizing how the distribution of strain changes across the field of view as load (or temperature, etc.) is applied. As a result, strain and displacement in the x, y, and z planes can be obtained at any point on the surface, at any time during the test.
- Graphical representation of the results provides an optimum understanding of material response.
- Strain computations for materials and complex components.
- 3D Shape capture and comparison to CAD.
- Characterization of creep and aging processes for long term health monitoring.
- Examination of non-linear behavior.
- Determination of material properties (R- and N-values, FLC, Young’s Modulus, etc…).
- Analysis of homogeneous and inhomogeneous material behavior during deformation.
- Verification of Finite Element Analysis models.
- High Resolution Systems
- Up to 1Mhz Sampling rate
- Fields of View from 500 microns to 100 meters
- Out-of-plane displacement measurement accuracy of 30 microns per meter
- In-plane displacement measurement accuracy 10x better than out of plane
- Strain measurement range [%] from 0.001 to > 300+
- Specimen Temperature from -100C up to +1500C
- Exportable STL file format for shape capture